17 Aug 2010, 22:16
Just a numerical answer to the original question....goldfill on the case was 80 micron = .0032 inch. On the bracelet, 20 micron = .0008 inch, less than a thousandth of an inch. It might just be practical to re-brush and put 20 microns of gold plate on the surface, but as was mentioned, an intermediate plating of nickel aids the bonding of the gold. The best system of all for steel is 5 microns of nickel, followed by 5 microns of copper, followed by the gold. Nickel bonds to iron, copper bonds to nickel, gold bonds to copper. Direct goldfill may have been simpler, after all... And if you do replate the bracelet, you'll run into the "carpet matching the drapes" problem...getting the color of the case and bracelet to precisely match. The color of the 14K yellow gold on the P2s is different from that used on the P3s, for example. You have to get the alloy exactly right, and then, I'm told the exact parameters of the plating process can have an effect on the color of the plating...I begin to understand now why nobody even attempts to do this...only workable answer sees to be, do the case and bracelet together, and with gold now above $1200 an ounce, reduces the practicality even more.