Never used the Circuitworks material, so can't make a direct comparison.  I've talked to a couple friends who know more about the subtleties of this than I do, and they tell me two things.  First, silver grain size is very important; the smaller, the better [this is especially true when applying it to very small surface areas, such as wire bonds,,,which is exactly what we're trying to do].  Some manufacturers make silver powder by abrasion [where a silver bar is essentially belt-sanded to dust].  They filter out the abrasive residue, and the larger silver particles, and go from there.  The better method is chemical precipitation, where a silver compound is chemically decomposed, releasing the silver as ultrafine particles [micron-sized] in solution.  The grain size is as small as you can get, and very uniform.  The end result is you get a more uniform distribution of silver in the bond, and the highest probability that they will be in contact, forming a conductive path.  Second, smaller particles do allow a greater percentage, by volume, of silver in the mix, without compromising bond strength.  As for bulk resistance, that's the resistance you'd add by sending your signal through a centimeter-thickness of the material.  Since the typical bond thickness is on the order of .004 inches [.01 cm], the actual increase in resistance is about a hundredth of the bulk value, or .0038 ohm, not much above a typical solder joint.  So, that's the story, and I'm sticking to it  

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